17.225mm 17.225mm a s s e m b l e d 8.25mm + ic thickness a a recommended torque = 1 in lbs./ 16 in oz. all tolerances: 0.125mm (unless stated otherwise). materials and specifications are subject to change without notice. ghz bga socket - direct mount, solderless features status: released drawing: h. hansen scale: - rev: b date: 3/17/04 file: sg-bga-6108 dwg.mcd SG-BGA6108 drawing ? 2009 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com 1 5 8 6 3 high speed, reliable elastomer connection compression plate distributes forces evenly ball guide prevents over compression of elastomer minimum real estate required directly mounts to target pcb (needs tooling holes) with hardware. customer's target pcb customer's bga ic 4 top view side view (section aa) easily removable swivel socket lid 2 7 9 modified: 6/12/09, ae page 1 of 3 10 socket lid: black anodized aluminum. thickness = 2.5mm. socket base screw: socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 1 elastomer guide: ultem 1000. thickness = 0.75mm. compression plate: black anodized aluminum. thickness = 2.5mm. elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). thickness = 0.75mm. socket base: black anodized aluminum. thickness = 5mm. ball guide: kapton polyimide. socket lid screw: shoulder screw, 18-8 ss, 0-80 fine thread. 10 socket base nut: 18-8 stainless steel, 0-80 fine thread. compression screw: clear anodized aluminum. thickness = 5mm, hex socket = 5mm. 2 3 5 7 9 6 8 nylon washer: 1.73mm id; 4.78mm od 0.64mm thickness. 11 12 ic guide: fr4 12 11 4
status: released drawing: h. hansen scale: 3:1 rev: b date: 3/17/04 file: sg-bga-6108 dwg.mcd sg-bga-6108 drawing ? 2009 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com modified: 6/12/09, ae page 2 of 3 recommended pcb layout tolerances: 0.025mm [0.00 1] unless stated otherwise. r e c o m m e n d e d p c b l a y o u t t o p v i e w t a r g e t p c b r e c o m m e n d a t i o n s total thickness: 1.6mm min. plating: gold or solder finish pcb pad height: same or higher than solder mask note: steel backing plate may be required based on end user's application * n o t e : b g a p a t t e r n i s n o t s y m m e t r i c a l w i t h r e s p e c t t o t h e m o u n t i n g h o l e s . socket body size mounting hole alignment hole orientation mark 1.25mm 0.125mm (x4) 1.25mm 0.125mm (x4) 5.08mm 17.225mm 0.125mm (x4) 14.725mm(x4) 0.8mm typ. ? 1.61mm 0.05mm (x4) ? 0.85mm 0.025mm (x2) ? 0.36mmpad 2.163mm 4.138mm* 2.54mm 9.95mm
status: released drawing: h. hansen scale: - rev: b date: 3/17/04 file: sg-bga-61089 dwg sg-bga-6108 drawing ? 2009 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com modified: 6/12/09, ae page 3 of 3 d e e y x ?0.25 ?0.10 z x y ?b 0.20 3 4 5 detail top view bottom view side view 3 4 5 dimensions are in millimeters. interpret dimensions and toleraces per asme y14.5m-1994. dimension b is measured at the maximum solder ball diameter, parallel to datum plame z. datum z (seating plane) is defined by the spherical crowns of the solder balls. parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. dim min max a 1.4 a1 0.25 0.35 b 0.50 d e e 8.00 bsc 12.00 bsc 0.80 bsc c o m p a t i b l e b g a s p e c array 10x14 a a1 detail 0.15 z z 0.20 z
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